Poly-forms flexible adhesive films and adhesive preforms are another no-mix, no-mess alternative to liquid adhesives. Several epoxy systems are available to meet the requirements of a wide range of applications. Manual loading or automated systems rapidly dispense Uni-form with minimal operator training for faster production rates. In addition, the solid epoxy seals eliminate the drips, variations, and mess of liquid epoxies. Close tolerances and consistent viscosity ensure repeatable results. Multi-Seals designs or selects custom configurations to match specific component designs. When heated, Uni-forms melt and set for consistent epoxy seals. Uni-forms precision epoxy preforms are pre-shaped resins that are solid at room temperature. We manufacture Uni-forms precision epoxy preforms, Poly-forms flexible adhesive films, and Wash-Aways dissolvable spacers. This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.įor more information on this source, please visit Master Bond Inc.Welcome to Multi-Seals, Inc. Master Bond adhesives are designed to meet specific performance requirements. Important Adhesive Performance Requirements For special requirements, custom formulations are available. They have earned a well-deserved reputation for their performance upon exposure to hostile environmental conditions. Master Bond film and preform systems are designed to offer superior quality and long-term durability. Master Bond film and preform systems are used for the following applications: Master Bond Film and Preform Systems are Used in a Wide Range of Applications Offers superior mechanical strength, convenient handling, good storage stability, and fast cures at moderate temperatures.īenefits of Master Bond Film and Preform Systemsįollowing are the benefits of Master Bond film and preform systems: High performance, thermally conductive, electrically insulative epoxy resin-based adhesive film system. High performance, silver-filled epoxy adhesive film system with outstanding electrical conductivity, excellent thermal conductivity, superior mechanical strength, convenient handling, good storage stability, and fast cures at moderate temperatures. Master Bond film and preform systems are given below. Successful industry applications include substrate attachment with minimal squeeze out, heat sink bonding, lid sealing, stress absorption, hybrids, connectors, and other electronic assemblies. Both performance and processing characteristics are highly reproducible from lot to lot. Preforms can be laser or die-cut to the configuration of any part. Films are available in thicknesses of 2 to 8 mils and up to 16 inches square. Grades can be adjusted for flexibility, electrical and thermal properties, temperature resistance, chemical resistance, etc. Master Bond's experienced technical staff can custom formulate these high-performance epoxy adhesive films and performs to best meet specific design and application requirements. The cured epoxy products offer excellent bond strength to both similar and dissimilar substrates plus high moisture and chemical resistance. Controllable flow enhances processing ease. Particularly desirable characteristics include long storage even at ambient temperatures, fast cures at moderately elevated temperatures, high adhesive strength, and excellent chemical resistance. These newly developed formulations include electrically conductive and thermally conductive compounds, as well as compositions with both thermal and electrical insulation properties. Jul 16 2010Įnhance productivity yields, simplify handling, save time, and reduce waste with Master Bond electronic grade epoxy films and preforms.
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